Process flow Cutting edge grinding → drilling → thickening of copper sink → outer layer pattern → inspection → etching → inspection → silk screen soldering resistance → inspection → silk screen characters → surface treatment → shape processing → inspection into the warehouse.
Double panel tin plate process
Cutting edge grinding → drilling → thickening of copper sink → outer layer pattern → inspection → etching → inspection → silk screen soldering → inspection → surface spray tin → hot air leveling → silk screen characters → shape processing → test → inspection → storage.
Double panel immersion gold process
Cutting edge grinding → drilling → thickening of copper sink → outer layer pattern → inspection → etching → inspection → silk screen soldering → inspection → silk screen characters → sinking gold → shape processing → test → inspection → storage.
Multi-layer board tin plate process
Cutting edge grinding→Drilling positioning→Inner layer pattern→Inner layer etching→Inspection→Blackening→Lamination→Drilling→Pinking thickening→Outer pattern→Inspection→Etching→Inspection→Screen printing resistance→Inspection→Surface Spray tin → hot air leveling → silk screen characters → shape processing → test → inspection → storage.
Multi-layer immersion gold process
Cutting edge grinding→Drilling positioning→Inner layer pattern→Inner layer etching→Inspection→Blackening→Lamination→Drilling→Pinking thickening→Outer pattern→Inspection→Etching→Inspection→Screen printing resistance→Inspection→Surface Shen Jin → hot air leveling → silk screen characters → shape processing → test → inspection → storage.
